Automatic Dispensing and Die Bonder DB-560EML

High-Precision Eutectic Die Bonder

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This machine is an automated production system designed to bond TO sockets to chips through a dispensing process after rotating the TO sockets to a specified angle (?) during the manufacturing process.

Manual Loading:

Place the TO socket strips into the carrier tray, and then position the tray onto the tray lift system.

Manually place the chip tray or blue film.

Automatic Workflow:

After starting the machine, the tray lift system raises and lowers, and the XY stage moves to transfer the TO socket strips onto the strip workstation and fix them in place.

The socket-handling robotic arm picks up the TO sockets and places them onto the dispensing and die attach workstation, clamps the sockets, and rotates them to the designated dispensing/placement angle.

The dispensing robot picks up adhesive from the glue tray and moves above the TO socket to apply the adhesive. Simultaneously, the chip-picking robot picks up chips from the wafer and places them onto the lower nozzle of the calibration workstation.

The calibration workstation performs XY and ? position compensation based on CCD2 recognition.

The dispensing robot picks up the chips and places them onto the TO sockets.

After completing the placement, the dispensing/placement workstation rotates the TO socket back to its initial angle. The pick-up nozzle returns the TO socket to the strip. This process continues until all sockets on the strip are completed.

Return the strip to the carrier tray and proceed with the next strip. Once both trays are completed, replace them with new trays to continue production.