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COC Eutectic Bonder
PH-550P is a eutectic bonding machine used in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.
The system is primarily composed of a eutectic bonding stage, chip placement robot, wafer stage (including chip trays), lower calibration stage, and automated loading/unloading robots.
The eutectic bonding stage features an X, Y, and T (theta) three-axis system, equipped with a pulse-heating module and nitrogen protection system.
The chip placement robot employs an X, Y, Z, and T (theta) four-axis mechanism for precise chip positioning and angular calibration.
The chip calibration stage includes an X, Y, and T three-axis system for front-side recognition of the chip, ensuring placement accuracy.
The eutectic bonding module uses pulse heating, allowing segmented temperature control, precise regulation of temperature ramp-up/down, and accurate soldering time.
1、Basic functions
Item | Description |
Eutectic Product | COC |
Substrate Loading | 2-inch tray |
Wafer Loading | Submount: 6-inch wafer, compatible with one 2-inch Waffle PAK Chip: 6-inch wafer, compatible with one 2-inch Gel PAK |
Eutectic Stage | 1 pulse-heating eutectic stage |
Eutectic Method | Single-piece bonding |
Eutectic Efficiency | Approximately 20 seconds per piece (substrate + submount + LD chip) |
2、Control section
Item | Description |
Operation Interface | GUI, wireless keyboard & mouse control + independent start/stop button |
Full System Initialization | Interface button |
Cylinder Control | Interface button |
Sensor Status Check | Interface button |
Motion Axis Position Check | Interface control |
Speed Adjustment | Interface control |
Production Information | Displayed on interface |
3、image recognition
Item | Description |
Number of CCDs | 6 |
CCD Functions | Submount wafer positioning, submount bottom positioning, chip wafer positioning, chip front-side calibration, eutectic stage positioning |
CCD Focusing | Manual adjustment |
CCD Resolution | 1280×960 |
CCD Lens | Zoom lens: 0.6–7× |
CCD Camera | 1.3 MP |
Lighting | Coaxial illumination, external LED ring light |
Light Brightness Adjustment | Independently adjustable for recognition/observation |
Recognition Method | Edge detection, feature teaching, similarity setting |
Angle Recognition Range | 0–360° |
Angle Recognition Error Rate | ≤0.1% |
Template Feature Editing | Erasable masking for interference features |
4、Mechanical arm
Item | Description |
Nozzle Change | Manual replacement |
Nozzle Material | Metal nozzle, bakelite nozzle |
Robot Functions | LD Pickup Robot: Picks LD chips from wafer and places on calibration stage LD Eutectic Robot: Picks LD chips from calibration stage and places onto eutectic stage Submount Pickup Robot: Picks submounts from wafer and places onto eutectic stage TO Base Handling Robot: Picks and places TO bases from tray |
Position Repeatability | X-axis ±1 μm, Y-axis ±1 μm, Z-axis ±2 μm, θ-axis ±0.01° |
Motor Type | X/Y axes: linear motor; Z/θ axes: stepper motor |
Placement Pressure Control | Nozzle weight + spring |
Placement Pressure Range | 10–200 g (adjustable spring) |
5、Pulse eutectic stage section
Item | Description |
Eutectic Method | Pulse heating |
Eutectic Area | 20×20 mm |
Stage Axes | X ±2 μm, Y ±2 μm, Z — , θ ±10°, accuracy ±0.01° |
Motor Type | X/Y: servo motor, Z: — , θ: stepper motor |
Stage Heating | Current pulse, segmented heating |
Stage Cooling | Air cooling |
Heating Rate | 150°/sec |
Environment | Nitrogen protection |
6、Bottom loading and unloading part
Item | Description |
Robot Axes | X ±2 μm, Y ±2 μm, Z ±2 μm, θ — |
Motor Type | X/Y: servo motor, Z: stepper motor, θ — |
Nozzle | Manual replacement |
Loading Method | Single-piece pickup & placement |
Trays | 2 pieces, 2-inch |
7、Electrical requirements
Item | Description |
Power Supply | AC, 220V, single phase |
Peak Power | 6000 W |
Compressed Air | 0.5–0.7 MPa |
Vacuum | 60–90 kPa |
Weight | 1500 kg |
Others | Nitrogen supply for nozzle & eutectic stage; compressed air filter; vacuum filter |
Operating Temperature | 26℃ |
Vibration Requirement | VC-D |
Equipment Noise | <50 dB |
Vacuum Pump Noise | <60 dB |
8、Appendix 1
Item | Description |
Manual | Chinese operation manual, paper and electronic version, one per unit |
Drawings – Electrical | 1 electronic copy |
Drawings – Pneumatic | 1 electronic copy |
9、Appendix 2
Item | Description |
Equipment Dimensions | X1640 × Y1420 × Z1840 mm |
Weight | 1500 kg |
Peak Power | 6 kW |
Air Pressure | 0.5–0.7 MPa |
Voltage | 220 V |
Production Efficiency | Approx. 20 seconds per piece (substrate + submount + LD chip) |
Positioning Accuracy | ±2 μm |
Angular Accuracy | ±0.01° |
Die Bonding Pressure | 10–200 g |
Wafer Size | 6" × 2 (tray 2"×2") |
Eutectic Stage Area | 20×20 mm |
Chip Size | 0.2–2 mm (other sizes optional) |